Features of XTM-105-F Series Hot Press Blister Machine:

1. The series hydraulic machine uses liquid pressure of 1-14 MPA as the power source, with an external three-phase AC380V 50HZ or three-phase AC220V 60HZ power supply. The maximum total power consumption does not exceed 8.5 KW.

2. Four-column three-plate structure ensures high parallelism accuracy between the movable plate and the working surface. Four precision guide sleeves provide high vertical accuracy during pressing.

3. Adjustable design with high bottom dead center positioning accuracy, achieving a repeat accuracy of 0.01 mm.

4. The hydraulic system is integrated inside the frame, offering a compact structure and an aesthetically pleasing appearance.

5. Equipped with casters and leveling feet at the bottom for easy mobility and efficient operation. The maximum weight of the series does not exceed 450 KG.

6. The working surface is fitted with a heat-treated heating plate and an intelligent temperature controller, allowing precise temperature control within 1 degree. The upper and lower mold temperatures can be controlled separately for convenient operation.

7. Optional electronic scale or grating scale with display can be added to accurately show the displacement of the cylinder.

8. Press stroke, pressure holding time, and closing height can be adjusted by the customer for easy operation.

9. The hydraulic machine series offers an output range from 3 tf, 5 tf, 10 tf to 50 tf (1 tf = 1000 kgf = 9.8 KN), and can also be customized according to customer requirements.

10. (Note: Specifications and parameters can also be customized based on customer needs.)

Applications:

1. Punching and cutting of silicone or plastic keys for mobile phones or remote controls, as well as trimming and slicing of plastic products.

2. Precision cutting of protective films for mobile phones, digital cameras, and laptop LCD screens, as well as various adhesive labels and trademarks.

3. Embossing, blistering, and forming of various film switches and panels such as PV, PE, and PC.

4. Pressing and forming of flexible circuit boards for laptop keyboards, among other applications.